MBB Ball Guide Bushings for Die Sets Bonded by Devcon Adhesive

Ball guide bushings are used in die set tooling to maintain smooth, repeatable alignment between the moving and fixed halves of a mold during press cycles. This MBB-type variant is bonded with Devcon adhesive, making it suitable for builds where guide position accuracy must be preserved during die wear, handling, and repeated cycling.

• Automotive and industrial press tooling: In die sets for forming or blanking, the ball guide bushing supports controlled guide movement, helping reduce binding and misalignment as the die cycles at high frequency.
• Large die-casting die sets: For die sets requiring stable guidance under load, the bonded interface provides reliable positioning so the guide alignment remains consistent across long production runs.
• High-repeatability incremental tooling: Where “bushing-only” replacement is needed, selecting the correct post diameter and length helps match the guide geometry in existing die designs.

The PD range and multiple length options in this series allow engineers to tune fit to cavity/core layout while relying on the adhesive-bonded construction for assembly stability.

The provided specifications describe the dimensional options and the Devcon adhesive bonded assembly method, but they do not list a specific steel grade or heat-treatment state for this bushing-only component. Therefore, the exact hardness (HRC), wear-resistance rating, and whether the steel is pre-hardened, quenched & tempered, or nitrided cannot be confirmed from the available data.

From an engineering standpoint, ball guide bushings used in die sets typically require a balance of wear resistance and toughness to withstand repetitive oscillation and contact loads; however, the exact trade-off for this series depends on the manufacturer’s material specification.

• Heat treatment: Not specified in the provided parameters.
• Hardness (HRC) / wear vs. toughness: Not specified in the provided parameters.
• Material comparison: No alternate material grades are listed in the provided data.

For accurate selection, request the steel grade/heat-treatment and target hardness for SKU/part 110100159610.

To select the correct ball guide bushing for an MBB-type die set, match the post diameter (PD), bushing length (L), and full length alteration (LC) to the guide pocket geometry in your die set.

• Post diameter (PD): Choose PD within 20 ~ 60 mm to fit the die-set mounting bore/post diameter. Select the closest design value to minimize clearance and maintain alignment.
• Bushing length (L): Available L options are 50, 50 ~ 60, 60 ~ 80, 80 ~ 100, and 100 ~ 120 mm. Pick the length that corresponds to the guided travel/stroke support length in the die.
• Full length alteration (LC): Set LC in the range 25 ~ 101 mm based on the required accommodation for mounting variation and operational positioning.

Because this is a bushing-only component bonded by Devcon adhesive, the final functional fit depends on the die pocket dimensions and adhesive bonding area. If your die design requires tight positional control, verify the cavity/core pocket machining tolerances and ensure sufficient bonded overlap for consistent positioning.