EMPGA Pin-Point Gate Processing Electrodes (Oxygen-Free Copper)

These oxygen-free copper point electrodes are used in injection mold tooling wherever pin-point gate processing and gate finishing are required, particularly after casting or during gate rework workflows. In die casting gates, they help maintain consistent electrical/processing stability so the gate geometry can be finished to a controlled profile.

• Pin-point gate finishing for die casting: Suitable when tight gate definition and repeatable finishing are needed; the oxygen-free copper variant supports stable conductivity for reliable machining/processing results.
• Gate processing in EMPGA-type electrode systems: Designed for compatibility with EMPGA electrode setups used by mold shops to standardize gate treatment sequences and reduce variation between runs.
• Multi-diameter mold gate applications: Available nominal diameters from 0.8 to 4 mm and selectable L lengths to match different gate sizes and recessed electrode standoff requirements.

With a specified taper angle range of 20–60°, the electrode can be matched to the required gate taper for consistent finishing performance.

This electrode is made from oxygen-free copper, selected for stable electrical conductivity and predictable machining/processing behavior. In gate processing contexts, this helps promote controlled wear characteristics, supporting repeatable electrode performance across production cycles.

• Conductivity & wear behavior: Oxygen-free copper supports steady current transmission and helps maintain consistent processing outcomes during gate finishing.
• Hardness/toughness trade-off: Copper offers good stability for processing tasks, but it is generally softer than tool steels; therefore, it’s best treated as an electrode/processing component rather than a high-wear mechanical tool insert.
• Heat treatment: No specific quench-and-temper, nitriding, or target HRC value is provided for this item; validation should be done against the supplier’s manufacturing documentation for any special finishing or conditioning steps.

Compared with steel electrodes, oxygen-free copper emphasizes conductivity and controlled processing behavior over maximum wear resistance.

Select the nominal diameter and L length to match the mold’s gate feature size and the electrode reach required by your gate processing setup. The available nominal diameter range is 0.8–4 mm, covering small to medium pin-point gate geometries.

• Nominal diameter (No.): Choose a diameter that fits the gate region targeted for finishing without forcing misalignment. Use the closest working diameter within 0.8–4 mm to maintain consistent gate profile results.
• L dimension: Select one of the provided 50–70 mm, 50–90 mm, or 50–110 mm options to achieve the required reach/standoff for the mold cavity/core layout.
• Taper angle (G): The taper angle is fixed within 20–60° selection; align the taper to the expected gate taper for controlled finishing.

Because tolerance values are not specified, confirm fit through your electrode holder and EMPGA-type system alignment requirements. If exact cavity depth varies, prefer the L range that provides full reach while minimizing unnecessary overtravel.